NANO- AND MICROSYSTEMS TECHNOLOGY

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INTERDISCIPLINARY, SCIENTIFIC, TECHNIQUE AND PRODUCTION JOURNAL

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Design, Test, Integration and Packaging of MEMS / MOEMS

5-7 May 2003 - Mandelieu-La Napoule, "Cote d'Azur", France

Chair: Bernard COURTOIS, TIMA, France
Co-Chair: Karen MARKUS, JDS Uniphase, USA

Conferences	Invitation to participate
CAD, Design and Test Chair: J. KORVINK, Univ. of Freiburg, Germany Co-Chair: J.M. KARAM, MEMScAP Grenoble, France Microfabrication, Integration and Packaging Chair: K. BERGMAN, Columbia Univ., New York, USA Co-Chair: B. MICHEL, IZM, Berlin, Germany Including Workshop on MEMS/MOEMS business developmentand Workshop on CAD needs for MEMS organized by NEXUS	This Symposium will be a follow-up to the very successful issues held in 1999 and 2000 in PARIS and in 2001 and 2002 in Mandelieu-La Napoule. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. DTIP 2002 was a great success, with 50% more submissions than in 2001. DTIP 2003 is expected to be again very attractive. We look forward to welcoming you to Mandelieu-La Napoule and encourage you to participate by submitting an abstract for one of the two Conferences. B. COURTOIS, TIMA K. MARKUS, JDS Uniphase
Submission of abstracts 1 November 2002	Notification of acceptance 31 December 2002
Conferences
CAD, Design and Test Chair: J. KORVINK, University of Freiburg, Germany Co-Chair: J.M. KARAM, MEMScAP Grenoble, France Programme Committee (TBD) This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks. The topics for this Conference include (preliminary): Technology CAD in general Modeling and simulation of fabrication processes Devices and components (sensors, actuators, ...) MEMS/MOEMS libraries and IP Signal processing Integrated CAD tools Numerical simulation Yield estimation Failure mechanisms Fault modeling Fault simulation and test pattern generation Thermal evaluation Interoperability of CAD/CAE tools Multidomain simulation Structured design methodologies Languages for interchange data among designs and tools	Microfabrication, Integrationand Packaging Chair: K. BERGMAN, Columbia University, New York, USA Co-Chair: B. MICHEL, IZM, Berlin, Germany Programme Committee (TBD) This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks. The topics for this Conference include (preliminary): Integrated processes (micromachining, micromolding, ...) Microlithography issues unique to MEMS/MOEMS Manufacturing Materials Assembly technologies Packaging for harsh environments MOEMS packaging RF and microwave packaging Test structures Devices & components (sensors, actuators...) Dimensional measurements Physical measurements Failure analysis Reliability Characterization Process monitoring
Plenary invited talks Plenary invited talks given by prominent speakers, a Workshop on MEMS/MOEMS business development and a Workshop on CAD needs for MEMS will also be planned. Contacts
Bernard COURTOIS TIMA E-mail: Bernard.Courtois@imag.fr Tel.: +33 476 574 615 Fax: +33 476 473 814 Jan Korvink University of Freiburg E-mail: korvink@imtek.uni-freiburg.de Tel.: +49 761 203 7381 Fax: +49 761 203 7382 Keren BERGMAN Columbia University E-mail: bergman@ee.columbia.edu Tel.: 212-854-2280 Fax: 212-854-1900	Karen MARKUS JDS Uniphase E-mail: markus@memsrus.com Tel.: +1 919 314 2300 Fax: +1 919 314 2201 Jean-Michel KARAM MEMScAP S.A. E-mail: Jean-Michel.Karam@memscap.com Tel.: +33 476 525 580 Fax: +33 476 525 581 Bernd MICHEL IZM E-mail: michel@izm.fhg.de Tel.: +49 304 6403 200 Fax: +49 304 6403 211
Exhibition An exhibition will be organized in the framework of the Symposium. CAD software, products, equipments, instruments, foundries offerings, ...etc, may be exhibited. Exhibitors who will register early enough will be given the opportunity to give a product presentation during the vendor session that will be placed in the Symposium programme. If you plan to exhibit, please contact the Symposium Chair. Specific Events Sponsoring If you wish to sponsor an event like a reception, a lunch, or any specific event during the Symposium, please contact the Symposium Chair. Location The Symposium will be held at the Sofitel Royal Casino in Mandelieu-La Napoule. The Sofitel Royal Casino is located between the Esterel and La Croisette, on one the most beautiful bay in the world. Cannes' combination of assets makes each event exceptional. Its sunny climate the whole year round, the richness of its landscapes, its modern infrastructure and its ease of access from the biggest cities of the world enable Cannes - Mandelieu - La Napoule to be the choice destination of DTIP 2003. Mandelieu-La Napoule is served by the International Nice-Cote d'Azur airport and by the airport of Cannes-Mandelieu (2km), by train, railway stations, Cannes or Manelieu-La Napoule, by car, Motorway A8 exit 40. Preferential rates are offered to the participants. The hotel reservation form is available. The first bookings will get priority on the sea view rooms. Paper Review To ensure a high-quality conference, all abstracts will be reviewed by the Programme Committee members under the leadership of the Conference Chairs, and the Proceedings papers will be reviewed by the Conference Chairs for technical merit and content. Oral or Poster Presentation Submitted papers may be selected for oral or poster presentation. All oral and poster presentations will be included in the Symposium Proceedings. Submission of Abstracts Your abstract must include the following: the conference you submit to (only one Conference, either CAD, Design and Test, or Microfabrication, Integration and Packaging). ABSTRACT TITLE AUTHOR LISTING (principal author first) First (given) name, Last (family) name, and affiliations, mailing address, telephone, fax and e-mail address. PRESENTATION Indicate your preference for "Oral Presentation" or "Poster Presentation". Placement is subject to chair's discretion. ABSTRACT TEXT Not less than 250 words, preferably 1500 words. KEY WORDS List a maximum of five key words. BRIEF BIOGRAPHY (of principal author) Approximately 50 words. Submission will be electronically only. Prospective authors should prepare an extended summary or the full paper to be submitted as PDF file. Uncompressed unencapsulated postscript may also be used when necessary. Use the contact author's last name as file name; add numerals in the case of multiple submissions (e.g., lo1, lo2). Detailed information about the submission process will be made available on the Symposium Web page. Authors should notify their submission to the Chair Bernard COURTOIS by e-mail: dtip2003@imag.fr Conditions of Acceptance Authors are expected to secure registration fees and travel and accommodation funding, through their sponsoring organizations, before submitting abstracts. Only original material should be submitted. Abstracts should contain enough detail to clearly convey the approach and the results of the research. Government and company clearance to present and publish should be final at the time of submittal. Commercial papers with no research, presenting products, cannot be submitted to the Symposium. Such papers can be presented in the framework of the exhibition (see corresponding section). Proceedings It is expected that the proceedings of the Symposium will be published by SPIE, the International Society for Optical Engineering. Proceedings published by SPIE are abstracted by INSPEC, Compendex, Current Contents, Chemical Abstract Service, Astrophysics Data System, International Aerospace Abstracts, and several others. The Proceedings of the Symposium will be available at the meeting.

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Design, Test, Integration and Packaging of MEMS / MOEMS

Conferences

Invitation to participate

CAD, Design and Test

Microfabrication, Integration and Packaging

Including

Submission of abstracts

Notification of acceptance

Conferences

CAD, Design and Test

Programme Committee (TBD)

Microfabrication, Integrationand Packaging

Programme Committee (TBD)

Plenary invited talks

Contacts

Exhibition

Specific Events Sponsoring

Location

Paper Review

Oral or Poster Presentation

Submission of Abstracts

Conditions of Acceptance

Proceedings