Int'l Workshop on MEMS and NANOTECHNOLOGY
INTEGRATION (MNI): APPLICATIONS

10-11 May 2004 -
Hotel Eden au Lac - Montreux, Switzerland.
Invitation

The Workshop will be held at the Hotel EDEN AU LAC
in Montreux, Switzerland

MOTIVATION

A Workshop on MEMS and Nanotechnology Integration will be held on 10-11 May 2004, under the auspices of the Aviation and Missile Research Development Engineering Center, European Research Office, US Army. The Workshop will be co-located with the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS to be held on 12-14 May 2004 in Montreux, Switzerland. Applications for MEMS devices continue to expand as the fabrication technology advances. But device requirements for system integration require a careful look at the technology issues that limit performance and lifetime or that restrict the architectural designs possible. These designs include compatibility of materials, mechanical interactions, electrical interconnection, vibration effects, thermal management, and vacuum or packing constraints. In additions, many of the device applications lend themselves to geometrical scaling extending to the NANO level, thus further challenging traditional approaches for stimulation or pick-off of signals and information. The use of optical techniques together with MEMS devices adds to the concerns of material choices and design requirements. Further advancements in the integration of MEMS and NANO devices for applications in inertial or environmental sensors, actuators, controllers, micro fluidics, RF components, and energy conversion will depend upon resolving the associated technical barriers.

OBJECTIVES

The workshop will focus on the identification of these technical barriers or issues, and then explore the possible approaches for solution. The program is arranged to provide adequate time for technical discussion stimulated by invited presentations directed toward a better understanding of the technical applications and issues of MEMS and NANO device integration. A broad range of technical expertise is expected to be represented by the workshop participants with opportunities for future technical collaborations. The results of the workshop will be collected and reported as part of a panel discussion during the Symposium on DTIP of MEMS/MOEMS (Thursday 13 May 2004).

TOPICS

The topics of special interest include:

Alternate Materials
Electronic Integration with MEMS Devices
Environmental Effects
Extension of MEMS to Nano Scale

ORGANIZING AND SCIENTIFIC COMMITTEE:

P. Ashley, AMRDEC, Redstone Arsenal, USA;
M. Marchetti, U. of Roma "La Sapienza", Italy;
P. Stevens, QinetiQ, UK;
L. Murdock, AMRDEC- European Research Office, London, UK;
M. Regi, U. of Roma "La Sapienza", Italy;
P. Ruffin, AMRDEC, Redstone Arsenal, USA;
M. Lyon, AMRDEC, Redstone Arsenal, USA;

Registrations must be sent in by April 23, 2004.
There is no registration fee for the workshop but everyone is required to register online for the Workshop and Symposium since there will be no on-site registration on the day of the workshop. To register for the workshop and the DTIP Symposium go to: http://tima.imag.fr/conferences/dtip/DTIP2004/index.html).

MEMS and NANO Integration Workshop
PROGRAM

Monday, May 10, 2004
12:00-1:00
1:00-1:45	Introduction and Overview of Issues, Paul Ashley, U.S. Army
Session 1 Alternate Materials Alma Wickenden, Session Chair
1:45-2:15	"Development of Mesoporous Oxide Films MEMS Structures" Bruce Dunn, University of California Los Angeles, USA
2:15-2:45	"Advantages and Challenges of Piezoelectric MEMS/NEMS Device Technology" Alma Wickenden, U.S. Army
2:45-3:00	Break
3:00-3:30	"MEMS Technology Based on CVD-Diamond" Ralph Mueller, University of ULM, Germany
3:30-4:15	Workshop Discussion
7:00-9:00	Reception
Tuesday, May 11, 2004 Session 2 Electronic Integration of MEMS Devices Marc Polosky, Session Chair
8:00-8:30	"Electrical and Optical Integration of Microsystems" Marc Polosky and Gerard Sleefe, Sandia National Lab, USA
8:30-9:00	"CMOS Compatible MEMS for Monolithically Integrated Microsystems" David King, QinetiQ, Malvern, UK
9:00-9:30	"Integration Approaches for Non-silicon MEMS" Mark Allen, Georgia Tech University, USA
Special Topics on MEMS Integration
9:30-9:45	"Recent developments in membrane supported millimeter wave circuits at IMT Bucharest" A Muller, D Neculoiu and D.Dascalu IMT Bucharest, Romania
9:45-10:00	"Why Do We Need a Surface Micromachining Technology with an On-Chip Integrated CMOS Electronics?" Andrzej Napieralski, Krzysztof Szaniawski, Technical University of Lodz, Poland
10:00-10:45	Workshop Discussion/Break
Session 3 Environmental Effects of MEMS Devices Fred Sexton , Session Chair
10:45-11:15	"What Will It Take to Have Reliable Microsystems?" Fred Sexton, Sandia National Lab, USA
11:15-11:45	"The Impact of Harsh Operational Environments on MEMS Design, Packaging, and Performance" Mike Kranz, Morgan Research Corp., USA
11:45-12:45	Lunch
12:45-1:15	TBD
1:15-1:45	Workshop Discussion
Session 4 Extension to NANO Scale Mario Marchetti/Marco Regi, Session Chairs
1:45-2:15	"Transition and Utilization of Nanotechnology for Energetic Applications" Mike Lyon and Richard Hatcher, U.S Army
2:15-2:45	"Design and Charactererization of Anisogrid Lattice Structures with Carbon Nanotubes" Mario Marchetti, Marco Regi, University of Rome, F.Mancia, Centro Sveluppo Materiali (C.S.M.) Pomerzia of Rome, Italy
2:45-3:15	"From Micro-Mechanics to Molecular Scale Mechanics" Panos Datskos, Oak Ridge National Labs, USA
3:15-3:30	Break
Special Topics on NANO Technology
3:30-3:45	"Boron and Carbon Doped Self-Assembling Biological Superstructures for Molecular Scale Sensory Elements" Kervalishvili Paata, Mrevlishvili George, Tbilisi State University, Georgia
3:45-4:00	"Characterization of Nano-Aluminized High-Energy Materials (HEM)" L. Galfetti, F. Severini, G. Colombo, L.T. DeLuca, SP Lab, Politecnico di Milano, Italy, L. Meda, Polimeri Europa, Italy A. Vorozhtsov, Institute for Problems of Chemical & Energetic Technologies, Russia, V. Sedoi, Institute of High Current Electronics, Russia, V. Babuk, BSTU, Russia, and B.N. Kondrikov, Mendeleev University, Russia
4:00-4:15	"Nanostructures, as New Object of Study of the Natural World Properties, Condition of Application and Obtaining" Valery A. Babuk, Baltic State Technical University, Russia
4:15-4:30	"Production of Nanosized Powders and Coatings by the Exploding Wire Method" M. Osmonoliev, V. Sedoi, Institute of High Current Electronics, Russia, A. Vosmerikov, Institute of Petroleum Chemistry, Russia, N. Zamyatin, Institute of High Current Electronics, Russia
4:30-4:45	"Advanced Technologies of Controlled Manufacturing and the Use of Nanometals in High-Energy Materials (HEM) Formulation" M. Lerner, Advanced Powder Technology Ltd., Russia, G. Pavlovets, V. Meleshko, Peter Research Center, Russia, A. Vorozhtsov, Institute for Problems of Chem. & Energ. Techn., SB RAS, Russia, V. Arkhipov, Tomsk State University, Russia, and L. DeLuca, Politecnico di Milano, Italy
4:45-5:15	"Synthesis of Small-Scale Boran-Rich NANO-Size Particles" Vladislav G. Slutsky, Sergei A. Tsyganov and Eugeny S. Severin, Russian of Sciences, Russia
5:15-5:30	Workshop Discussion
5:30-5:45	Workshop Wrap-up and Conclusions

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