NANO- AND MICROSYSTEMS TECHNOLOGY


01-03 June 2005 - Hфtel Eden au Lac - Montreux, Switzerland.
Sponsored by
CNRS - INPG - UJF	Test Technology Technical Council IEEE Computer Society	IEEE Components, Packaging and Manufacturing Technology Society The Institute of Electrical and Electronics Engineers, Inc.
In cooperation with
IEEE Circuits and Systems Society
Chair:Bernard COURTOIS,TIMA Labs, Grenoble, France Co-Chair:Karen MARKUS,Zeus Strategies, LLC, Durham, USA

Conferences

Invitation to participate

CAD, Design and Test

Chair: G. WACHUTKA,
Munich University of Technology, Germany

Co-Chair: J-M. KARAM,
MEMSCAP, Bernin, France

Microfabrication, Integration and Packaging

Chair: E. JUNG,
IZM, Berlin, Germany

Co-Chair: M. ESASHI,
Tohoku University, Japan

Including Workshop

Design for Micro & Nano Manufacture

This Symposium will be a follow-up to the very successful issues held in 1999 and 2000 in Paris, in 2001, 2002 and 2003 in Mandelieu-La Napoule and 2004 in Montreux Switzerland. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems.
We look forward to welcoming you to Montreux and encourage you to participate by submitting an abstract for one of the two Conferences.

B. COURTOIS
K. MARKUS

Submission of abstracts: 12 November 2004

Notification of acceptance: 14 January 2005

Conferences
CAD, Design and Test	Microfabrication, Integration and Packaging
Chair: G. WACHUTKA, Munich U.T., Germany Co-Chair: J-M. KARAM, MEMSCAP, Bernin, France Programme Committee B. Charlot, TIMA Labs, Grenoble, France M. Santiago, Univ. Barcelona, Spain M. Rencz, BUTE, Budapest, Hungary M. Ismail, Ohio State Univ., Columbus, USA F. Pressecq, CNES, Toulouse, France R. Laur, Univ. of Bremen, Germany B. Romanowicz, Nano Science & Technology Institute, Cambridge, USA R. Rudd, Lawrence Livermore National Lab., Livermore, USA Y.C. Liang, National Univ. of Singapore I. Balk, The Ramzay Technologies Inc, Brighton, USA J. Zhu, Nanjing Electronic Devices Institute, China J. Samitier, Univ. of Barcelona, Spain S. Blanton, Carnegie Mellon Univ., Pittsburgh, USA O. Sigmund, TU of Denmark, Lyngby, Denmark A. Kaiser, IEMN, Lille, France A. Wild, Motorola, Munich, Germany M.A. Maher, SoftMEMS, Los Gatos, USA B. Vigna , STMicroelectronics, Cornadero, Italy F. Maloberti, Texas A&M Univ., College Station, USA Z. Cui, RAL, Didcot, UK T. Mukherjee, Carnegie Mellon Univ., Pittsburgh, USA P. Wu, National Chiao Tung Univ., Hsinchu City, Taiwan C. Cane, Univ. of Barcelona, Spain T. Veijola, Helsinki Univ. of Technology, Finland A. Richardson, Lancaster University, UK O. Slattery, NMRC, Cork, Ireland P. Salomon, 4M2C PATRIC SALOMON, Berlin, Germany This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks. The topics for this Conference include (preliminary): • Technology CAD in general • Modeling and simulation of fabrication processes • Devices and components (sensors, actuators, ...) • MEMS/MOEMS libraries and IP • Signal processing • Integrated CAD tools • Numerical simulation • Yield estimation • Failure mechanisms • Fault modeling • Fault simulation and test pattern generation • Mechanical simulation • Thermal evaluation • Interoperability of CAD/CAE tools • Multiphysics simulation • Structured design methodologies • Languages for interchange data among designs and tools • Model order reduction	Chair: E. JUNG, IZM, Berlin, Germany Co-Chair: M. ESASHI, Tohoku U., Japan Programme Committee F. Tay, National Univ. of Singapore J. Dual, ETH Zentrum, Zьrich, Switzerland M. Heckele, FZK, Karlsruhe, Germany H. Wicht, Wicht Technologie Consulting, Munich, Germany D. Allen, Cranfield Univ., Bedford, UK R. Maeda, MEMS and Packaging Research Group, AIST, Tsukuba, Japan G.S. Kuo, National Chengchi Univ., Taipei, Taiwan A. Tay, National Univ. of Singapore K. Sato, Nagoya Univ., Japan B. Michel, IZM, Berlin, Germany C. Khan Malek, Lab. FEMTO-ST/LPMO, Besanзon, France P. Viktorovitch, LEOM, Ecully, France V. Kempe, Sensor Dynamics AG, Austria H. Hartnagel, TU Darmstadt, Germany V. Bright, Univ. of Colorado, Boulder, USA Z. Wang, Singapore Institute of Manufacturing Technology, Singapore P. Nicole, Thales Group, France H. Yang, National Chung Hsing Univ., Taiwan D. Collard, CIRMM/IEMN, Villeneuve d'Ascq, France D. Tolfree, Technopreneur Ltd, Warrington, UK P. French, TU Delft, The Netherlands D. Seeger, IBM, Watson Research Center, Yorktown Heights, USA G-J. Wang, National Chung Hsing Univ., Taiwan Y. Wang, SIMIT Shanghai, China T. Bourouina, ESIEE, Noisy le Grand, France S. Basrour, TIMA Labs, Grenoble, France K. Bergman, Columbia Univ., New York, USA This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks. The topics for this Conference include (preliminary): • Integrated processes (micromachining, micromolding, ...) • Process integration between MEMS and electronics • Microlithography issues unique to MEMS/MOEMS • Manufacturing • Materials • Assembly technologies • Packaging for harsh environments • MOEMS packaging • RF and microwave packaging • Test structures • Devices & components (sensors, actuators, ...) • Dimensional measurements • Physical measurements • Failure analysis • Reliability • Characterization • Process monitoring • Non destructive evaluation
A Workshop on "Design for Micro & Nano Manufacture" is planned to take place on 30/31 May in conjunction with DTIP. This workshop will feature intermediate results from the new European Network of Excellence "Design for Micro & Nano Manufacture (Patent-DfMM)", and also discuss industry's needs in this area. PATENT-DfMM aims to establish a collaborative team to provide European industry with support in the field of "Design for Micro and Nano Manufacture (DfMM)" to ensure that problems affecting the manufacturing and reliability of products based on micro nano technologies (MNT) can be addressed before prototyping and production. Contact: Patric Salomon.

Plenary invited talks Plenary invited talks given by prominent speakers will include:
Takahito Ono, Tohoku University, Japan	*Micro/Nanomechanical Instrumentations for Nanoengineering* Miniaturized microtools based on recent nano/micromachining technology increase its importance in nanoscale science and engineering. Micro/nano probes for nanometric sensing and processing, including multi probes for scientific measurement and data storage, near-field optical probe with tweezers, ultra-sensitive mass and force sensors will be presented.
Philippe Renaud, EPFL, Lausanne, Switzerland	*MicroFluidic Cell Manipulation and Modification Devices* This paper presents recent developments in BioMEMS for flow cytometry. Biological cells flowing into microfulidic channels can be manipulated, analysed and modified by electrical field that are applied in micro-electrodes. Dielectrophoresis (DEP) forces is be used to filter, separate or trap cells. Single cell analysis is preformed by electrical impedance spectroscopy by comparing impedance spectra (real and imaginary part) at different frequencies. High electrical field in micro-channels can also be used to perform electroporation at the single cell level.

Contacts
Bernard COURTOIS TIMA Tel.: +33 476 574 615 Fax: +33 476 473 814	Karen MARKUS Zeus Strategies Tel.: +1 919 806 4682 Fax: +1 919 806 4990

Exhibition An exhibition will be organized in the framework of the Symposium. CAD software, products, equipments, instruments, foundries offerings, ...etc, may be exhibited. Exhibitors who will register early enough will be given the opportunity to give a product presentation during the vendor session that will be placed in the Symposium programme.
If you plan to exhibit, please contact the Symposium Chair.

Specific Events Sponsoring

If you wish to sponsor an event like a reception, a lunch, or any specific event during the Symposium, please contact the Symposium Chair.

Advertising in the programme booklet

The programme booklet will be widely distributed to announce the Symposium. If you wish to advertise in the programme booklet, please contact the Symposium Chair.

Location

The Symposium will be held at the Hфtel Eden au Lac in Montreux, Switzerland.
On the shores of lake Geneva, the Hфtel Eden au Lac overlooks the lake and the majestic Alps to the south.
The hotel is less than an hour away from Geneva airport. The distance from Geneva international airport is 90km.

• Time & cost by taxi: approx. 45 minutes & approx. SFr 300.
• Time & cost by train: approx. 70 minutes & approx. - second class SFr 31, first class SFr 52.

Paper Review

To ensure a high-quality Symposium, all abstracts will be reviewed by the Programme Committee members under the leadership of the Conference Chairs, and the Proceedings papers will be reviewed by the Conference Chairs for technical merit and content.

Oral or Poster Presentation

Submitted papers may be selected for oral or poster presentation. All oral and poster presentations will be included in the Symposium Proceedings.

Submission of Abstracts

Your abstract must include the following:

• ABSTRACT TITLE
• AUTHOR LISTING (principal author first)

First (given) name, Last (family) name, and affiliations, mailing address, telephone, fax and e-mail address.

• PRESENTATION

Indicate your preference for "Oral Presentation" or "Poster Presentation".
Placement is subject to chair's discretion.

• ABSTRACT TEXT

Not less than 250 words, preferably 1500 words.

• KEY WORDS

List a maximum of five key words.

• BRIEF BIOGRAPHY (of principal author)

Approximately 50 words.

Submission will be electronically only.

Detailed instructions will be posted in due time on the Symposium web site.
Questions may be directed in the meantime by e-mail.

Conditions of Acceptance

Authors are expected to secure registration fees and travel and accommodation funding, through their sponsoring organizations, before submitting abstracts. Abstracts should contain enough detail to clearly convey the approach and the results of the research. Government and company clearance to present and publish should be final at the time of submittal.
Commercial papers with no research, presenting products, cannot be submitted to the Symposium. Such papers can be presented in the framework of the exhibition (see corresponding section).

Special Issues of Journals and Magazines

It is a tradition that Special Issues of Journals and Magazines are published after the Symposium. These Special Issues collect revised versions of papers presented during the Symposium.
DTIP 2005 Special Issues will be organized in the Journal of Microsystem Technologies and in the Journal of Analog Integrated Circuits and Signal Processing.

Proceedings

Proceedings of the Symposium will be available at the meeting.